Photoinitiated curing epoxy resins –
DELO®-KATIOBOND®

• One-component epoxy resins
• Curing is triggered by UV or visible light
  (see "DELOLUX® curing lamps")

• Rapid and secure bonding, even of non-transparent
  components
• Shortest cycle times
• Rapid further processing

Dam&fill products for smart cards This protects the sensitive chips.		Fixing soldered contacts of electronic components The adhesive provides secure protection against unsoldering and strong shocks

• Dry surface
• Outstanding adhesion on different materials
• Good tension-equalizing behaviour
• Low-viscous to pasty

• Micro-electronics
• Electronics / electrical engineering
• Automotive supplier industry
• Smart Card industry
• Plastic processing