Flip-chip bonding
The adhesive does the job
of the underfiller (no-flow underfilling) and the contacting in one process
step
Fixing
of SMD components Tailor-made adhesive -
DELOMONOPOX®
MK096 - for fixing melves and glass SMD components
Properties:
DELOMONOPOX®
AC:
Enable production in the smart card and smart label industries
to be made markedly more efficient by highly automated processes.
For example, in flip-chip
technology the chip is set and contacted in one process step
DELOMONOPOX®:
Extremely rapid curing
For flip-chip bonding and as Die Attach
Fixing
of SMD components
Chip encapsulation compounds for the automotive sector
and high-quality industrial products
