Smart card / smart label

Smart card, smart label – adhesives for the chip card
technology

Chip card technology includes the following fields:

  • Module manufacturing
  • Contact cards
  • Dual-interface cards
  • Contacless cards and
    smart labels
  • Multi-functional cards
FCOS - Infineon Technologies

DELO® adhesives are suitable for all these fields:

Application examples:

Opaque chip encapsulation Opaque chip encapsulation with Dam&Fill products
The demand for black chip encapsulation compounds results from increased requirements on safety. According to these requirements, the chip must be protected against unauthorized viewing or copying
 
 
Dam&Fill

Dam&Fill – protection for chips
- Defined encapsulation geometry
- Minimum height of the encapsulation
- Lower stress on the bond wires
 
 
Flip-chip bonding Flip-chip technology – even smaller, even faster
Non-conductive, no-flow underfillers are used for contacting flip-chips with anisotropic conductive adhesives, or for flip-chips with stud bumps