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Even smaller, even faster: Flip-chip technology
With
flip-chip technology the chip is bonded on the substrate with its active side
face down, and contacted at the same time.
For contacting flip-chips, anisotropic
conductive adhesives are used or non-conductive adhesives for flip-chips with stud bumps. |
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Contacting flip-chips with DELOMONOPOX® AC anisotropic
conductive adhesives
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Easy and rapid application of the
adhesive on the full
surface of the contact areas of the substrate. | The chip, which is only slightly heated, is easily pressed into the activated adhesive. |
Bonding flip-chips with non-conductive
DELOMONOPOX®
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| DELOMONOPOX®
is applied easily. Its optimum flowing leads to good process results – without
long capillary times. |
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The chip is positioned and is rapidly and
securely fixed under a defined contact pressure with the DELOMONOPOX®. |
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