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Do you have issues with fixing melves for reflow process shaft-soldering?
Is the bonding of glass SMD components giving you a headache?
Are you jetting your SMD adhesive onto the printed circuit board in order to speed processes?
DELO®
has developed an adhesive especially for these requirements, and has tested
it for the production of sensors, control boards, etc. DELOMONOPOX®
MK096 is an SMD adhesive based on a heat-curing, one-part epoxy resin - optimized
for high-speed processes as well as for manual production.
The advantages at a glance
- Efficiency
- Fast
curing
- Good processability on standard systems (jetting, dispensing, printing)
- High
temperature resistance
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| |
SMD
adhesive DELOMONOPOX®
MK096 |
| Base | heat-curing,
one-component epoxy resin | | Curing
| minimum curing temperature
+100 °C
(+212 °F) | Ion
content
Na+, K+, F- | <
10 ppm | | Viscosity
| pasty |
| Short-time
temperature range of use |
+250 °C (+482 °F) | | Shear
strength |
25 N (5.6 lb) after 60 s | |
