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UV-curing encapsulation compounds are state-of-the-art in the chip card industry.
However, curing with light requires that the encapsulation compounds be
permeable to radiation - i.e. transparent. The demand for black chip encapsulation
compounds results from increased requirements on safety. According to these requirements
the chip must be protected against unauthorized viewing or copying.
By further developing a DELO®-patented curing mechanism, we created
black Dam&Fill products which cure by a combination
of UV light and heat.
Thus, all the advantages of light curing - fast processes
for high production volumes - can be utilized, while still meeting high safety requirements.
 | DELO®-DUALBOND
-
absolutely opaque even in thin layers |
The advantages
of our black Dam&Fill compounds in an overview:
- High productivity
by fast curing within 30 to 60 seconds
- Highest reliability by adjusted
mechanical properties and low ion content
- Standardized encapsulation systems
are available
- Dam&Fill form a homogeneous unit
| | DELO®-DUALBOND
DF741 und DF796 | | Color |
Black;
opaque to light in the visible, UV and near IR range |
| Elasticity | Tough-elastic
and thus tension-equalizing | | Viskosity |
2,000
mPas (cP) (fill); 120,000 mPas (cP) (dam) |
| Curing | UV
light and heat in combination | | Shore
hardness |
D68 (fill); D72 (dam) |
| Shear
strength |
28 MPa (4,060 psi) after final curing |
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