Dam&Fill

DELO®-KATIOBOND® Dam&Fill adhesives:

The dam made from a highly viscous DELO®-KATIOBOND® is dispensed around the chip.Dam process
When filling the dam with a low viscosity DELO®-KATIOBOND® as fill compound, a rectangular encapsulation geometry is built to a minimum height.  Fill process
Rapid curing of dam and fill by UVA light in 30 - 60 s at an intensity of 60 - 120 mW/cm². Dam and fill form a homogeneous unit. Curing

Ideal properties:
  • Defined encapsulation geometry
  • Minimum height of the encapsulation
  • Lower stress on the bond wires