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With consumer products, such as electronic toys, productivity is the key to the economic success of the products - especially as regards the encapsulation
of the ICs contained in the products.
DELO®
has made allowance for these requirements and adjusted its fast UV-curing adhesives,
successfully used in smart cards for years, to the special requirements of this
sector: - Fast curing by UV-light (DELO®-KATIOBOND®
products)
or heat (DELOMONOPOX®
products)
- Suitable for inline processes
- Tailored, low coefficients
of expansion
- Low water absorption
- Low corrosion potential by high
ion purity
- Opacity from the UV to the near IR-range with the heat-curing
products, such as DELOMONOPOX®
GE592
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Chip
encapsulation with the UV-curing DELO®-KATIOBOND®
GE680 - optimized for fast processes and thus for high production
quantities.
Curing time: 30 s |
Properties:
- > 1,000 cycles -40 / +120 °C (-40 / +248 °F) in temperature
shock test
- > 1,000 h climate storage at +85 °C (+185 °F)/85%
r. h. under 25 mA
- Threefold flow through lead-free soldering profile
- High
ion purity Cl-, Na+, K+ < 10 ppm
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