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Electronic components in the automobile sector are subject to extreme
conditions: They are operated in a wide temperature range, are exposed
to extreme vibrations and forces, and are in frequent contact with aggressive substances.
DELO® has met these
requirements and offers a series of purpose-designed chip encapsulation compounds:
DELOMONOPOX®
GE720, GE752, GE780, GE790
- Low coefficients of expansion
in a wide
temperature range - High glass transition temperatures
- Good
adhesion
- Low shrinkage during polymerization
- Low post-curing potential
- Excellent
chemical resistance
- Temperature resistant up to +170 °C (+338 °F)
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Chip
encapsulation in the automobile sector -
extremely good thermal and chemical
resistance |
Special properties:
- > 1,000
cycles temperature shock test -40 / +150 °C
(-40 / +302 °F) - >
1,000 h storage in +85 °C (+185 °F)/85% r. h. climate under 25 mA
- Threefold
flow through lead-free soldering profile
- 1,000 h high-temperature storage
at +150 °C (+302 °F)
- 1,000 h oil storage at 150 °C (+302 °F)
- Vibration
tests and others
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