 |
In cooperation with well-known customers, DELO®
has developed and tested products especially tailored to the requirements of
assembly processes:
- Reliable adhesion to plastics, metals, ceramic
and silicon - even under demanding conditions
- Fast curing at
moderate temperatures
- Ion purity (semiconductor grade)
- Utmost
quality and long-term stability
Applications:
 | | 1.
2.
3.
4.
5.
6.
7.
8.
| Bonding
of covers to PCBs
(protective function)
Bonding and sealing of housing
halves
Protection of components
against manipulation
Bonding of sensors
to carriers
NCA or ACA for flip-chips
Fixing of coils
Bonding of ceramic
chip modules (carrier modules) to PCB housing and package
Vibration protection
of electrolytic capacitors
|
In
the illustration the adhesive is colored blue or shown as a line, to make
the bondings visible - although they are invisible in practice.
|
DELOMONOPOX®
MK055 is a special product, which can cure very fast without influencing the ability of the adhesive to withstand chemicals and temperatures.
Overview
of technical data:
| |
DELOMONOPOX®
MK055 |
| Viscosity
| 40,000 mPas at 23
°C
(40,000 cP at +73 °F) | | Tensile
strength | 50
MPa (DIN EN ISO 527)
(7,250 psi) | | Elongation
at tear | 1.2
% | | Temperature
range of use |
-40 to +150 °C (-40 to +300 °F)
for short times up to +180 °C (+350
°F) | | Glass
transition temperature |
+146 °C (+295 °F) | | Coefficient
of linear expansion |
+30 to +100 °C: 64 ppm/K
(+86 °F to +212 °F: 64
ppm/K)
+130 to +160 °C: 186 ppm/K
(+266 °F to +320 °F:
186 ppm/K) | | Processing
time at rt |
1 week | Storage
life at rt /
at +5 °C (+41 °F) |
2 weeks /
6 months | |
